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Sheila Chopin
Sheila Chopin
NXP Semiconductors
Metallurgy
Materials science
Viscoelasticity
Epoxy
Molding (process)
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Corrosion of Copper Wire bonded Packages by Chlorine Containing Foreign Particles
2020
ECTC | Electronic Components and Technology Conference
Varughese Mathew
Enakshi Wikramanayake
Sheila Chopin
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