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Ming Jui Li

National Cheng Kung University

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Cu-Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5D/3D Chip Integration Technologies

2020 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Efficiency enhancement of blue light emitting diodes by eliminating V-defects from InGaN/GaN multiple quantum well structures through GaN capping layer control

2018 Applied Surface Science
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