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Tia-Marje K. Korhonen
Tia-Marje K. Korhonen
Cornell University
Microstructure
Eutectic system
Metallurgy
Ranging
Soldering
3
Papers
81
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Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C
2007
Journal of Electronic Materials
Tia-Marje K. Korhonen
Lawrence Lehman
M. A. Korhonen
Donald W. Henderson
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Citations (54)
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
2004
Journal of Electronic Materials
Tia-Marje K. Korhonen
Pekka Turpeinen
Lawrence Lehman
Brian Bowman
George H. Thiel
Raymond C. Parkes
Mattt A. Korhonen
Donald W. Henderson
Karl J. Puttlitz
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Citations (21)
Interconnections based on Bi-coated SnAg solder balls
2001
IEEE Transactions on Advanced Packaging
Tia-Marje K. Korhonen
Vesa Vuorinen
Jorma Kivilahti
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Citations (6)
1