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Jun Wang
Jun Wang
Atotech
Composite material
Coating
Materials science
Copper
Adhesion
3
Papers
17
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Electroless and Electrolytic Copper Plating of Glass Interposer Combined with Metal Oxide Adhesion Layer for Manufacturing 3D RF Devices
2016
ECTC | Electronic Components and Technology Conference
Zhiming Liu
Hailuo Fu
Sara Hunegnaw
Jun Wang
Michael Merschky
Tafadzwa Magaya
Akira Mieno
Aric Shorey
Satoru Kuramochi
Miyuki Akazawa
Hobie Yun
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Citations (8)
A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer
2015
Zhiming Liu
Sara Hunegnaw
Hailuo Fu
Jun Wang
Tafadzwa Magaya
Michael Merschky
Tobias Bernhard
Aric Shorey
Hobie Yun
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Citations (4)
VitroCoat GI - Ultra-thin adhesive layer for metallization of glass interposer
2015
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Sara Hunegnaw
Zhiming Liu
Hailuo Fu
Jun Wang
Michael Merschky
Kenichiroh Mukai
Tafadzwa Magaya
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Citations (5)
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