Old Web
English
Sign In
Acemap
>
authorDetail
>
J.-L. Huguenin
J.-L. Huguenin
STMicroelectronics
CMOS
Materials science
Optoelectronics
Through-silicon via
Semiconductor device modeling
3
Papers
23
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A DOE study of plasma etched microlens shape for CMOS image sensors
2020
D. Ristoiu
Francois Leverd
Etienne Mortini
J.-L. Huguenin
Show All
Source
Cite
Save
Citations (0)
Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs
2010
IITC | International Interconnect Technology Conference
Lionel Cadix
Maxime Rousseau
C. Fuchs
P. LeDuc
Aurélie Thuaire
R. El-Farhane
H. Chaabouni
R. Anciant
J.-L. Huguenin
Perceval Coudrain
A. Farcy
C. Bermond
Nicolas Sillon
B. Flechet
Pascal Ancey
Show All
Source
Cite
Save
Citations (23)
Ultra-Thin (4nm) Gate-All-Around CMOS devices with High-k/Metal for Low Power Multimedia Applications
2009
J.-L. Huguenin
Stephane Monfray
G. Bidal
Stephane Denorme
Pierre Perreau
Nicolas Loubet
Yves Campidelli
M.-P. Samson
Christian Arvet
K. Benotmane
Francois Leverd
Pascal Gouraud
B. Le-Gratiet
C. De-Butet
L. Pinzelli
Rémi Beneyton
S. Barnola
T. Morel
Aomar Halimaoui
Frederic Boeuf
Gérard Ghibaudo
Thomas Skotnicki
Show All
Source
Cite
Save
Citations (0)
1