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U. Chul
U. Chul
Intermetallic
Microstructure
Materials science
Electromigration
Composite material
1
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5
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Mechanism of electromigration in Au/Al wirebond and its effects
2009
ECTC | Electronic Components and Technology Conference
Emil Zin
Nancy L. Michael
Sukhoon Kang
Kyu Hwan Oh
U. Chul
J.S. Cho
J. T. Moon
Choong Un Kim
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