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Y. S. Koh Drake

UTAC Group

Materials science
Electronic engineering
Through-silicon via
Flip chip
Stacking

3

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10

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Multi chip stacking & reliability challenges using TSV-micro C4 solder interconnection for FCCSP TSV package

2011 EPTC | Electronics Packaging Technology Conference
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Thru Silicon Via Stacking & Numerical Characterization for Multi-Die Interconnections using Full Array & Very Fine Pitch Micro C4 Bumps

2011 Electronic Components and Technology Conference
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