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G.M. Adema
G.M. Adema
University of North Carolina at Charlotte
Embedded system
Computer science
Thermal copper pillar bump
Electroplating
Electronic engineering
3
Papers
17
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Development of Seamless High Off-Chip Connectivity
1997
Mitchell G. Dibbs
Philip E. Garrou
C. C. Chau
Y. So
D. Frye
J. Wagner
J. Ousley
D. Baugher
J. Santandrea
G. Connor
J Macpherson
G.M. Adema
P. Dean
L. Schaper
R Eden
R. Sands
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Chip Scale Packaging with High Reliability for Mcm Applications
1996
Mark Loboda
Robert Charles Camilletti
L. Goodman
Lawrence K. White
H. L. Pinch
J. Shaw
Vipulkumar Patel
C. P. Wu
G.M. Adema
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Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections
1994
Ndt & E International
G.M. Adema
C.J. Berry
Nicholas G. Koopman
Glenn A. Rinne
Edward K. Yung
Iwona Turlik
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Citations (14)
1