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A. Hausmann
A. Hausmann
Infineon Technologies
Engineering
Electromigration
Microstructure
Copper interconnect
Analytical chemistry
2
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27
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The influence of the SiN cap process on the electromigration and stressvoiding performance of dual damascene Cu interconnects
2003
IRPS | International Reliability Physics Symposium
A. von Glasow
Armin Fischer
D. Bunel
G. Friese
A. Hausmann
O. Heitzsch
Martina Hommel
Jakob Kriz
Sabine Penka
P. Raffin
C. Robin
H.-P. Sperlich
Franz Ungar
A. Zitzelsberger
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Citations (27)
Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization
2001
Microelectronics Reliability
Detlef Weber
Falko Hohnsdorf
A. Hausmann
A Klipp
Z Stavreva
J Herrmann
L Bauch
H Neef M.Junack
M Nichterwitz
S Finsterbusch
R Liebmann
N Kallis
Albrecht Kieslich
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