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Gyeong Mok Jo
Gyeong Mok Jo
Intermetallic
Shear strength
Semiconductor
Composite material
Interconnection
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Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
2019
Seong Hyeon Son
Jeong A Gim
Yu Jin Bak
Gyeong Mok Jo
Nam Hyeon Gang
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