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Josef Meiler
Josef Meiler
EV Group
Wafer-level packaging
Wafer bonding
Optoelectronics
Light-emitting diode
Microelectromechanical systems
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Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
2019
ECTC | Electronic Components and Technology Conference
Matthias Wietstruck
Sebastian Schulze
Bernhard Rebhan
Peter Kerepesi
Helmut Kurz
Gerald Silberer
Josef Meiler
Selin Tolunay Wipf
Christian Wipf
Mehmet Kaynak
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Wafer bonding process for building MEMS devices
2014
Eric Pabo
Josef Meiler
Thorsten Matthias
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