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Shin Low

Xilinx

7

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Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire

2018 Microelectronics Reliability
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O 2 plasma induced deionization of high Ag alloy in wire bond integrated circuit

2015 ECTC | Electronic Components and Technology Conference
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Mechanical and board level reliability considerations of lidless flip chip BGA packaging

2013 ECTC | Electronic Components and Technology Conference
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Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

2012
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