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Yun Kwon Park

Korea Institute of Science and Technology

7

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A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon

2003 MEMS | International Conference on Micro Electro Mechanical Systems
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A novel low-loss wafer-level packaging of the RF-MEMS devices

2002 MEMS | International Conference on Micro Electro Mechanical Systems
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Thin PDP packaging technology by direct-joint method

2001 IDRC | International Display Research Conference
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Thin PDP packaging technology by direct-joint method

2001
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Microtunneling sensors for vacuum level evaluation of field emission display devices

2001 Journal of Vacuum Science & Technology B
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