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Liu Caroline Chen

Katholieke Universiteit Leuven

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Steady State and Transient Thermal Characterization for Flip Chip Interconnection on Flexible Substrate

2006 International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
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Enabling SPICE-type modeling of the thermal properties of 3D-stacked ICs

2006 EPTC | Electronics Packaging Technology Conference
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Electro-thermal-mechanical Analysis of A HQUAD Package for High Current and High Power Application

2005 THERMINIC | International Workshop on Thermal Investigations of ICs and Systems
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