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Coen Tak
Coen Tak
Electrical engineering
Electronic engineering
Engineering
Wafer
Microelectromechanical systems
5
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5
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Stress-Compensating MEMS Sensor Assembly
2017
ECTC | Electronic Components and Technology Conference
Harald Etschmaier
Anderson Pires Singulani
Coen Tak
Kai Zoschke
Danny Jaeger
Hermann Opperman
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Citations (2)
A Robust Thin-Film Wafer-Level Packaging Approach for MEMS Devices
2010
Journal of microelectronics and electronic packaging
Krishnan Seetharaman
Bart van Velzen
Johannes van Wingerden
Hans van Zadelhoff
Cadmus Yuan
Frank Rietveld
Coen Tak
Joost van Beek
P.H.C. Magnée
H.C.W. Beijerinck
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Citations (3)
A Robust Wafer-Level Capping Approach for MEMS Devices
2010
Krishnan Seetharaman
Bart van Velzen
van ZadelhoffHans
Cadmus Yuan
Frank Rietveld
Coen Tak
Joost van Beek
Jan-Jaap Koning
P.H.C. Magnée
Johannes van Wingerden
H.C.W. Beijerinck
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Sensor Packaging: New Challenges for New Applications
2010
Caroline Beelen-Hendrikx
Coen Tak
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Exploring the ulthimo platform
2006
EPTC | Electronics Packaging Technology Conference
M. de Samber
Coen Tak
Wil Peels
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