author-photo

Xiaowu Hu

Nanchang University

113

Papers

1105

Citations

Citation Trend

Filter By

Papers (81) Sort By

Journal Conference Others

Microencapsulation of Al-Zn alloy as phase change materials for high-temperature thermal storage application

2022 Materials Letters
Show All
- Source
- Cite
- Save
Citations (0)
A novel method for fabricating micron-scale porous structure on the surface of commercially-pure Ti

2021 Materials Letters
Show All
- Source
- Cite
- Save
Citations (0)
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux

2021 Journal of Materials Science: Materials in Electronics
Show All
- Source
- Cite
- Save
Citations (0)
Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints

2021 Journal of Manufacturing Processes
Show All
- Source
- Cite
- Save
Citations (5)
Effect of ultrasonic treatment on interfacial reactions and microstructure of SnCr/CuFeNiCoCr solder joints

2021 Journal of Materials Science: Materials in Electronics
- Qing Yang
- Xiaowu Hu
Show All
- Source
- Cite
- Save
Citations (0)
Fe doped Ni–Co alloy by electroplating as protective coating for solid oxide fuel cell interconnect application

2021 International Journal of Hydrogen Energy
Show All
- Source
- Cite
- Save
Citations (0)
Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering

2021 Journal of Manufacturing Processes
Show All
- Source
- Cite
- Save
Citations (4)
Enhanced thermal performance of phase-change materials supported by mesoporous silica modified with polydopamine/nano-metal particles for thermal energy storage

2021 Renewable Energy
Show All
- Source
- Cite
- Save
Citations (3)
Contextual Fine-to-Coarse Distillation for Coarse-grained Response Selection in Open-Domain Conversations

2021 arXiv: Computation and Language
Show All
- Source
- Cite
- Save
Citations (0)
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

2021 Journal of Materials Science: Materials in Electronics
Show All
- Source
- Cite
- Save
Citations (1)