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Saba Tasneem
Saba Tasneem
Indian Institute of Science
Optoelectronics
Silicon
Copper
Heat spreader
Engineering
2
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Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies
2021
Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
Pavani Vamsi Krishna Nittala
Karthika Haridas
Shivam Nigam
Saba Tasneem
Prosenjit Sen
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Enabling Transfer of Ultra-Thin Layers of GaN for Demonstration of a Heterogenous Stack on Copper Heat Spreader
2019
IEEE Transactions on Components, Packaging and Manufacturing Technology
Pavani Vamsi Krishna Nittala
Nayana Remesh
Niranjan S
Saba Tasneem
Srinivasan Raghavan
Rangarajan Muralidharan
Digbijoy N. Nath
Prosenjit Sen
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