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Chidai Shima

Materials science
probe array
Optoelectronics
Electronic engineering
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Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

2020 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Development of 3D-Stacked Multi-Shank Si Neural Probe Array (1) - Fabrication of Embedded Multiple Optical Fibers in Multi-Shank -

2018 The Japan Society of Applied Physics
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