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Mahadevan Suryakumar

Intel

6

Papers

28

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Chip-package codesign with redistribution layer

2009 EPEP | Electrical Performance of Electronic Packaging
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Dual Die Package Design Strategy and Performance

2005
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Power delivery validation of processor front side bus

2005 ECTC | Electronic Components and Technology Conference
- Mahadevan Suryakumar
- Jiangqi He
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Power delivery validation methodology and analysis for network processors

2004 ECTC | Electronic Components and Technology Conference
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Citations (9)