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Piefke
Piefke
Mold
Stacking
Embedding
Copper
Composite material
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3D stacking approaches for mold embedded packages
2011
EMPC | European Microelectronics and Packaging Conference
Braun
Becker
Piefke
Voges
Thomas
Topper
Fischer
Kahle
Bader
Bauĕr
Aschenbrenner
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