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Herbert Struyf

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Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers

2016
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30nm half-pitch metal patterning using Motif (TM) CD shrink technique and double patterning - art. no. 69242C

2008
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30nm half-pitch metal patterning using Moti CD shrink technique and double patterning

2008
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