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Heat Bit Park
Heat Bit Park
SK Hynix
Electronic engineering
Computer science
Dram
Embedded system
Big data
2
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142
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A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control
2018
ISSCC | International Solid-State Circuits Conference
Jin Hee Cho
Jihwan Kim
Woo-Young Lee
Dong-Uk Lee
Tae-Kyun Kim
Heat Bit Park
Chun-Seok Jeong
Myeong-Jae Park
Seung Geun Baek
Seokwoo Choi
Byung Kuk Yoon
Young Jae Choi
Kyo Yun Lee
Daeyong Shim
Jonghoon Oh
Jinkook Kim
Seok-Hee Lee
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25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV
2014
ISSCC | International Solid-State Circuits Conference
Dong-Uk Lee
Kyung-Whan Kim
Kwan Weon Kim
Hongjung Kim
Ju Young Kim
Young-Jun Ichon Park
Jae Hwan Kim
Dae-Suk Kim
Heat Bit Park
Jin Wook Shin
Jang Hwan Cho
Ki Hun Kwon
Minjeong Kim
Jae-Jin Lee
Kun Woo Park
Byongtae Chung
Sung Joo Hong
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Citations (119)
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