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Pardeep K. Bhatti
Pardeep K. Bhatti
Intel
Materials science
Soldering
Temperature cycling
Ball grid array
Electronic engineering
5
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Field condition reliability assessment for SnPb and SnAgCu solder joints in power cycling including mini cycles
2006
ECTC | Electronic Components and Technology Conference
Min Pei
Xuejun Fan
Pardeep K. Bhatti
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