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Ivor G Barber
Ivor G Barber
Xilinx
Electronic engineering
Interconnection
Chip
Composite material
Materials science
2
Papers
9
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A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications
2015
DIC | IEEE International D Systems Integration Conference
Gamal Refai-Ahmed
Ivor G Barber
Anthony Torza
Brian D. Philofsky
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Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package
2015
ECTC | Electronic Components and Technology Conference
Bahareh Banijamali
Tom Lee
Henley Liu
Suresh Ramalingam
Ivor G Barber
Jonathan Chang
Myongseob Kim
Laurene Yip
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Citations (9)
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