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Gojun Hu
Gojun Hu
Composite material
Materials science
Delamination
Polymer
Viscoelasticity
1
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11
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Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages
2006
EPTC | Electronics Packaging Technology Conference
Gojun Hu
A.A.O. Tay
Yong Zhang
Wenhui Zhu
Spencer Chew
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Citations (11)
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