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JimDL Chen
JimDL Chen
Microelectronics
Molding (process)
Chip-scale package
Transfer molding
Surface-mount technology
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Design for Void Free Transfer Molding SiP
2020
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Bing-Yuan Huang
Ian Hu
JimDL Chen
David Tarng
Cp Hung
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