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Giovanni Campardo
Giovanni Campardo
University of Bologna
Electronic engineering
Signal integrity
Electrical engineering
System in package
Printed circuit board
6
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58
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Signal Integrity Flow for System-in-Package and Package-on-Package Devices : Signal degradation in these packages can be avoided by a practical design process that uses appropriate rules to simplify modeling, simulation, and analysis
2009
Paolo Pulici
Gian Pietro Vanalli
Michele A. Dellutri
Domenico Guarnaccia
Filippo Lo Iacono
Giovanni Campardo
G. Ripamonti
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Scanning the Issue: 3-D Integration Technologies
2009
Giovanni Campardo
G. Ripamonti
Rino Micheloni
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Citations (4)
Risks for Signal Integrity in System in Package and Possible Remedies
2008
ETS | European Test Symposium
Daniele Rossi
Paolo Angelini
Cecilia Metra
Giovanni Campardo
Gianpietro P. Vanalli
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A Reduced Output Ringing CMOS Buffer
2007
IEEE Transactions on Circuits and Systems Ii-express Briefs
Michele Bartolini
Paolo Pulici
Pier Paolo Stoppino
Giovanni Campardo
Gianpietro P. Vanalli
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Citations (21)
1