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Hiroyuki Tenmei
Hiroyuki Tenmei
Hitachi
Electronic engineering
Materials science
Composite material
Copper
Polyimide
3
Papers
3
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Electronics Packaging Technology and New Energy Technology
2010
Journal of Japan Institute of Electronics Packaging
Hiroyuki Tenmei
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Resin-Molded High Frequency Multi-Chip Modules in Face-up Structure
1998
Journal of Japan Institute of Electronics Packaging
Kiichi Yamashita
Matsuo Yamasaki
Hiroji Yamada
Osamu Kagaya
Nobuyuki Sugii
Kenji Sekine
Akio Takahashi
Masahiro Suzuki
Hiroyuki Tenmei
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Development of Multilayer Wiring Board by Simultaneous Stacking Method of Tape Film
1998
Journal of Japan Institute of Electronics Packaging
Masakazu Ishino
Hiroyuki Tenmei
Shuji Eguchi
Mamoru Mita
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