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Shu-Sheng Yu
Shu-Sheng Yu
Non-volatile memory
Copper interconnect
Tungsten
Engineering
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A self-aligned double patterning technology using TiN as the sidewall spacer
2012
ASMC | Advanced Semiconductor Manufacturing Conference
Yuan-Chieh Chiu
Shu-Sheng Yu
Fang Hao Hsu
Hong-Ji Lee
Nan-Tzu Lian
Tahone Yang
Kuang-Chao Chen
Chih-Yuan Lu
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