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Ashwani K. Malhotra
Ashwani K. Malhotra
IBM
Microprocessor
Electronic engineering
Engineering
Ceramic
CMOS
4
Papers
10
Citations
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Chip/Package Design andTechnology Trade-offs inthe65nmCellBroadband Engine
2007
P. Harveyl
Y. Zhoul
G Yamada
Kazushige Kawasaki
David L. Questad
Gary LaFontant
R. Mandrekarl
S. Suminaga
Yoshiyuki Yamaji
Hirokazu Noma
Toshihiko Nishio
Hiroyuki Mori
Tetsuji Tamura
Kazuaki Yazawa
I. Takiguchi
T Ohde
R White
Ashwani K. Malhotra
Jean Audet
J. Wakill
Wolfgang Sauter
Eiichi Hosomi
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Chip/Package Design and Technology Trade-offs in the 65nm Cell Broadband Engine
2007
ECTC | Electronic Components and Technology Conference
Paul M. Harvey
Yaping Zhou
G Yamada
David L. Questad
Gary LaFontant
Rohan Mandrekar
S. Suminaga
Yoshiyuki Yamaji
Hirokazu Noma
Toshihiko Nishio
Hiroyuki Mori
Tetsuji Tamura
Kazuaki Yazawa
Takiguchi
T Ohde
R White
Ashwani K. Malhotra
Jean Audet
Jamil A. Wakil
Wolfgang Sauter
Eiichi Hosomi
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MCM-D/C packaging solution for IBM latest S/390 servers
2000
IEEE Transactions on Advanced Packaging
Eric D. Perfecto
Ronald R. Shields
Ashwani K. Malhotra
Mathias P. Jeanneret
D. McHerron
G.A. Katopis
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MCM-D/C packaging solution for IBM latest S/390 servers
1999
APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
Eric D. Perfecto
Ronald R. Shields
Mathias P. Jeanneret
Ashwani K. Malhotra
D. McHerron
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