Old Web
English
Sign In
Acemap
>
authorDetail
>
ken'iti ho te hama
ken'iti ho te hama
Soldering
Electrode
Materials science
Composite material
Semiconductor device
3
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Electrode structures and bump forming method
2007
taniguti yasusi
yasusi taniguti
nakatani seiiti
seiiti nakatani
takasi hokkou
yasuharu karasima
ken'iti ho te hama
Show All
Source
Cite
Save
Citations (0)
Electronic component assembly, electronic components with solder bumps, solder resin mixture, method of mounting an electronic component, and a method of manufacturing an electronic component
2007
takasi hokkou
nakatani seiiti
seiiti nakatani
yasuharu karasima
kyou sawada
ken'iti ho te hama
Show All
Source
Cite
Save
Citations (0)
Bump forming method and a bump forming apparatus
2000
yasuharu karasima
taniguti yasusi
yasusi taniguti
nakatani seiiti
seiiti nakatani
ken'iti ho te hama
takasi hokkou
kyou sawada
Show All
Source
Cite
Save
Citations (0)
1