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Yun Zhuang

8

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5

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Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

2014
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Triblogical, Thermal, and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes

2012 Advanced Semiconductor Manufacturing Conference
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Performance of a Novel Slurry Injection System on an Ebara F-REX200 Polisher for a Silicon Dioxide CMP Application

2012
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Physics and modeling of fundamental CMP phenomena

2005
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Measurement of diamond conditioner microwear

2005
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