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Tomotoshi Sato
Tomotoshi Sato
Electronic engineering
Composite material
Materials science
Flip chip
Interconnection
6
Papers
266
Citations
0.02
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Cu Bump Interconnections in 20 μm-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI
2003
Journal of Chemical Engineering of Japan
Yoshihiro Tomita
Tadahiro Morifuji
Manabu Tomisaka
Masahiro Sunohara
Yoshihiko Nemoto
Tomotoshi Sato
Kenji Takahashi
Manabu Bonkohara
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Citations (8)
Mechanical effects of copper through-vias in a 3D die-stacked module
2002
ECTC | Electronic Components and Technology Conference
Naotaka Tanaka
Tomotoshi Sato
Y. Yamaji
Tadahiro Morifuji
M. Umemoto
Kenji Takahashi
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Citations (38)
Superfine flip-chip interconnection in 20/spl mu/m-pitch utilizing reliable microthin underfill technology for 3D stacked LSI
2002
ECTC | Electronic Components and Technology Conference
Mitsuo Umemoto
Yoshihiro Tomita
Tadahiro Morifuji
Tatsuya Ando
Tomotoshi Sato
Kenji Takahashi
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Citations (10)
Thermal characterization of bare-die stacked modules with Cu through-vias
2001
ECTC | Electronic Components and Technology Conference
Yasuhiro Yamaji
Tatsuya Ando
Tadahiro Morifuji
Manabu Tomisaka
Masahiro Sunohara
Tomotoshi Sato
Kenji Takahashi
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Citations (17)
Development of advanced 3D chip stacking technology with ultra-fine interconnection
2001
ECTC | Electronic Components and Technology Conference
Kenji Takahashi
Masataka Hoshino
Hitoshi Yonemura
Manabu Tomisaka
Masahiro Sunohara
Michinobu Tanioka
Tomotoshi Sato
Kazumi Kojima
Hiroshi Terao
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Citations (42)
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