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Chin-Liang Chen
Chin-Liang Chen
I-Shou University
Parametric statistics
Finite element method
Electronic engineering
Interferometry
Engineering
2
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3
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0
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Parametric StudyandOptimal Design inWireBonding Process forMiniStack-Die Package
2006
International Conference on Electronic Packaging Technology
Hung-Chun Ho
Ming-Cheng Lu
Cheng-Tung Lee
Chin-Liang Chen
Chien-Hung Liao
Yu-Jung Huang
Shen-Li Fu
Li-Shan Chen
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Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package
2006
ICEPT | International Conference on Electronic Packaging Technology
Hsiang-Chen Hsu
Shen-Wen Yu
Yu-Teng Hsu
Wei-Yaw Chang
Ming-Jer Lin
Ruei-Ming Lin
Pei-Chieh Chin
Hung-Chun Ho
Ming-Cheng Lu
Cheng-Tung Lee
Chin-Liang Chen
Chien-Hung Liao
Yu-Jung Huang
Shen-Li Fu
Li-Shan Chen
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Citations (3)
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