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Ying-Xu Lu
Ying-Xu Lu
Surface roughness
Intermetallic
Grain growth
Engineering
Electromigration
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Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation
2017
ICSJ | CPMT Symposium Japan
Ying-Xu Lu
Ying-Ta Chiu
Tang Yuan Chen
Meng Kai Shih
Sheng-Rui Jian
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