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Andreas Schenke
Andreas Schenke
Telecommunications
Through-silicon via
Hybrid silicon laser
Electronic engineering
Wafer
6
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15
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Processing of ultrathin 300 mm wafers with carrierless technology
2011
ECTC | Electronic Components and Technology Conference
Sven Spiller
Froilan Molina
Jürgen M. Wolf
Jurgen Grafe
Andreas Schenke
Dietrich Toennies
Marc Hennemeyer
Tomotaka Tabuchi
Hans Auer
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A method for building up a telecommunication connection and a telecommunication network
2002
Ansgar Bergmann
Andreas Schenke
Bernd Goesele
Martin Lorang
Karl Eigler
Thomas Witthaut
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A method for establishing a telecommunication connection and a telecommunication network
2002
Ansgar Bergmann
Andreas Schenke
Bernd Goesele
Martin Lorang
Karl Eigler
Thomas Witthaut
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