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Ho Chi Wong
Ho Chi Wong
Thermocompression bonding
Ultrasonic sensor
Die (manufacturing)
Composite material
Process window
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Control of Dynamic sp3-C Stereochemistry
2021
Aisha N. Bismillah
Toby Johnson
Burhan A Hussein
Andrew T. Turley
Ho Chi Wong
Juan A. Aguilar
Dmitry S. Yufit
Paul R. McGonigal
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Room-Temperature Ultrasonic Bonding of Semiconductor Thin-Dies with Die Attach Films on Glass Substrates
2009
Japanese Journal of Applied Physics
Sui Yin Wong
Siu Wing Or
Ho Chi Wong
Yiu Ming Cheung
Ping Kong Choy
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2P8-9 Die Attach Filmを介してガラス基板上に半導体Dieを溶着する室温超音波溶接(ポスターセッション)
2008
Siu Wing Or
Sui Yin Wong
Ho Chi Wong
Yiu Ming Cheung
Ping Kong Choy
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Ultrasonic Bonding of Die Attach Film (DAF)-Laminated Thin Silicon Dies on Glass Substrates at Room Temperature
2008
EPTC | Electronics Packaging Technology Conference
Sui Yin Wong
Ho Chi Wong
Siu Wing Or
Yiu Ming Cheung
Ping Kong Choy
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