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Bjorn Bohme
Bjorn Bohme
Dresden University of Technology
Electronic engineering
Computer science
Epoxy
Electronic packaging
Mechanical engineering
3
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3
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Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
2019
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Laura Wambera
Karsten Meier
Robert Hohne
Bjorn Bohme
Christian Götze
Jens Paul
Marcel Wieland
Karlheinz Bock
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Qualification of Organic Substrate Materials for High Temperature Automotive Applications
2007
ISSE | International Spring Seminar on Electronics Technology
Bjorn Bohme
Olaf Decreßin
Klaus-Jurgen Wolter
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Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints
2006
ISSE | International Spring Seminar on Electronics Technology
Bjorn Bohme
Mike Rollig
S. Wiese
Klaus-Jurgen Wolter
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