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François Lechleiter
François Lechleiter
Engineering
Electronic engineering
Printed circuit board
Lamination
Material properties
5
Papers
9
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0
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Characterization of Thin Woven Composites Used in Printed Circuit Boards by Combining Numerical and Experimental Approaches
2018
World Academy of Science, Engineering and Technology, International Journal of Architectural and Environmental Engineering
Gautier Girard
Marion Martiny
Sébastien Mercier
Mohamad Jrad
Mohamed-Slim Bahi
Laurent Bodin
François Lechleiter
David Nevo
Sophie Dareys
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In-plane thermal diffusivity measurement of thin plates by the transient fin method
2018
Review of Scientific Instruments
Yves Jannot
Alain Degiovanni
Arthur Aubert
François Lechleiter
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Thermo-mechanical simulation of PCB with embedded components
2016
Microelectronics Reliability
W. Kpobie
Marion Martiny
Sébastien Mercier
François Lechleiter
Laurent Bodin
A. Lecavelier des Etangs-Levallois
M. Brizoux
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埋込み部品を内蔵したPCBの熱機械的シミュレーション【Powered by NICT】
2016
Microelectronics Reliability
W. Kpobie
Marion Martiny
Sébastien Mercier
François Lechleiter
Laurent Bodin
A. Lecavelier des Etangs-Levallois
M. Brizoux
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Simulation 2D thermomécanique des cartes de circuit imprimé avec composants enterrés
2015
Wiyao Kpobie
Marion Martiny
Sébastien Mercier
François Lechleiter
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