Old Web
English
Sign In
Acemap
>
authorDetail
>
Y. Y. Tan
Y. Y. Tan
Infineon Technologies
Intermetallic
Materials science
Wire bonding
Copper
Aluminium
1
Papers
7
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Cu-Al IMC micro structure study in Cu wire bonding with TEM
2010
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Y. Y. Tan
F. K. Yong
Show All
Source
Cite
Save
Citations (7)
1