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Ic Chuang
Ic Chuang
Electronic engineering
Materials science
Pillar
Thermal copper pillar bump
Semiconductor
1
Papers
5
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0
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FC Cu pillar package development for broad market applications
2015
ECTC | Electronic Components and Technology Conference
Robert Cheng
Mark Wang
Roger Ho Kuo
Elson Chen
Ic Chuang
Benjamin Pai
Jenny Chang
Calvin Cheung
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Citations (5)
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