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D. Hawn

Dow Chemical Company

5

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A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

2004 EPTC | Electronics Packaging Technology Conference
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Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics

2000 IEEE Transactions on Advanced Packaging
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Underfill adhesion to BCB (CycloteneTM) bumping and redistribution dielectrics

2000 IEEE Transactions on Advanced Packaging
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Underfill adhesion to Cyclotene/sup TM/ (BCB) dielectrics

1999 APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
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