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Kazuhiro Isaka
Kazuhiro Isaka
Hitachi
Composite material
Flip chip
Materials science
Thermal expansion
Adhesive
5
Papers
29
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回路部材接続用接着剤、回路板、及びその製造方法
2009
Kazuhiro Isaka
Kazuyoshi Kojima
Akira Nagai
Kenzo Takemura
Itsuo Watanabe
Osamu Watanabe
kazuhiro isaka
kazuyosi kozima
akira nagai
izu otto watanabe
osamu watanabe
kenzou takemura
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Estimation by Thremo-Viscoelastic Analysis for Warp Deformation of Flip Chip Attached LSI
1999
Journal of Japan Institute of Electronics Packaging
Shozo Nakamura
Gen Murakami
Kazuhiro Isaka
Keii Ueno
Keiichi Nakamura
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Anisotropic Conductive Adhesive Films for Flip-chip Interconnection onto
1998
Organic Substrates
Akira Nagai
Kenzo Takemura
Kazuhiro Isaka
Osamu Watanabe
Kazuyoshi Kojima
Kazuya Matsuda
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Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates
1998
IEMT | International Electronics Manufacturing Technology Symposium
Akira Nagai
Kenzo Takemura
Kazuhiro Isaka
O. Watanabe
Kazuyoshi Kojima
K. Matsuda
Itsuo Watanabe
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Citations (20)
Water-Soluble Calixarene as the First Man-Made Catalyst for Regioselective Cleavage of Ribonucleoside 2′,3′-Cyclic Phosphate.
1992
ChemInform
Makoto Komiyama
Kazuhiro Isaka
Seiji Shinkai
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