Old Web
English
Sign In
Acemap
>
authorDetail
>
D. Crouthamel
D. Crouthamel
LSI Corporation
Soldering
Flip chip
Composite material
Microstructure
Materials science
3
Papers
15
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Development fine pitch area array Cu pillar/lead free solder bumps for large 28nm die in large organic flip chip packages
2014
ECTC | Electronic Components and Technology Conference
John W. Osenbach
Sue Emerich
Steven D. Cate
D. Brady
Seung Min Hwang
J. Dang
D. Crouthamel
Show All
Source
Cite
Save
Citations (1)
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage
2009
Journal of Electronic Materials
John W. Osenbach
Ahmed Amin
Mark Adam Bachman
Frank A. Baiocchi
D. Bitting
D. Crouthamel
John M. DeLucca
D. Gerlach
J. Goodell
C. Peridier
M. Stahley
R. Weachock
Show All
Source
Cite
Save
Citations (14)
1