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Tatsunosuke Nakada
Tatsunosuke Nakada
Kanto Gakuin University
Inorganic chemistry
Materials science
Electrode
Chip
Electroless nickel
4
Papers
3
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0
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Influence of Complexing Agents on Adhesion Strength of Electroless Nickel–Phosphorus Plating to Silicon Nitride–Aluminum–Polyimide Mixed Substrates
2014
Bulletin of the Chemical Society of Japan
Tomiyuki Arakawa
Nobuaki Watanabe
Tatsunosuke Nakada
Junki Oshikiri
Hiroshi Umemoto
Akira Hashimoto
Ichiro Koiwa
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Selective deposition on electrodes of chip component by electroless plating method
2014
Japanese Journal of Applied Physics
Akihiro Yamamoto
Nobuaki Watanabe
Tomiyuki Arakawa
Miku Gotou
Tatsunosuke Nakada
Kenta Fukui
Akira Hashimoto
Ichiro Koiwa
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Optimization of Pretreatment Conditions for Electroless Ni-P Plating Simultaneously on Various Substrates for High Density Packaging
2013
Journal of The Surface Finishing Society of Japan
Tatsunosuke Nakada
Nobuaki Watanabe
Junki Oshikiri
Akira Hashimoto
Ichiro Koiwa
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