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Hiroaki Okabe
Hiroaki Okabe
Mitsubishi Electric
Electronic engineering
Materials science
Junction temperature
Composite material
Thermal conductivity
5
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30
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Experimental Demonstration of Ruggedness in 13 kV SiC-IGBT
2020
Materials Science Forum
Kazuya Konishi
Kenji Hamada
Hiroaki Okabe
Yusuke Miyata
Hiroki Niwa
Kohei Ebihara
Kotaro Kawahara
Naoyuki Kawabata
Shingo Tomohisa
Naruhisa Miura
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Properties of a SiC Schottky Barrier Diode Fabricated with a Thin Substrate
2014
Materials Science Forum
Yosuke Nakanishi
Takaaki Tominaga
Hiroaki Okabe
Yoshiyuki Suehiro
K. Sugahara
Takeharu Kuroiwa
Yoshihiko Toyoda
Satoshi Yamakawa
Hiroyuki Murasaki
Kazuo Kobayashi
Hiroaki Sumitani
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High Temperature Reliability of the SiC-MOSFET with Copper Metallization
2014
Materials Science Forum
Hiroaki Okabe
Motoru Yoshida
Takaaki Tominaga
Jun Fujita
Kazuyo Endo
Yoshinori Yokoyama
Kazuyasu Nishikawa
Yoshihiko Toyoda
Satoshi Yamakawa
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Impact of an LPT(II) concept with Thin Wafer Process Technology for IGBT's vertical structure
2009
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Katsumi Nakamura
Daisuke Oya
Shoji Saito
Hiroaki Okabe
Kazunari Hatade
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Citations (14)
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