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Kiichiro Higaki
Kiichiro Higaki
Toshiba
Materials science
Composite material
Electronic engineering
Quad Flat No-leads package
Chip-scale package
2
Papers
6
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0
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2024
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High Thermal Die-Attach Paste Development for Analog Devices
2020
ECTC | Electronic Components and Technology Conference
Kiichiro Higaki
Toru Takahashi
Akinori Ono
Daisuke Koike
Masahiko Hori
Keiichi Kusaka
Takayuki Nishi
Takeshi Mori
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A novel Wafer level Fan-out Package (WFOP™) applicable to 50um pad pitch interconnects
2011
EPTC | Electronics Packaging Technology Conference
Naoki Hayashi
Tomoko Takahashi
Nobuaki Shintani
Takanori Kondo
Hisakazu Marutani
Yasuyuki Takehara
Kiichiro Higaki
Osamu Yamagata
Yasuhiro Yamaji
Akio Katsumata
Yoichi Hiruta
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Citations (6)
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