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Shintaro Iwahashi
Shintaro Iwahashi
Wafer
Grinding
Materials science
Automotive engineering
Manufacturing engineering
5
Papers
9
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Loop Stiffness of Grinding Machine Developed for 450 mm Silicon Wafers
2016
Advanced Materials Research
Jumpei Kusuyama
Shintaro Iwahashi
Takayuki Kitajima
Nagahisa Ogasawara
Akinori Yui
Hirotsugu Saito
Alexander H. Slocum
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Citations (3)
S1310101 Development of Rotary Grinding Machine for 450mm Si Wafer : Positioning accuracy of wheel spindle which creates both rotary and axial feed motions
2015
Shintaro Iwahashi
Ayumu Honda
Jumpei Kusuyama
Takayuki Kitajima
Akinori Yui
Hirotsugu Saito
Alexander H. Slocum
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B28 Development of Grinding Machine for 450mm Wafer : Fundamental Performance of Wheel Spindle which creates both rotary and axial feed motion
2014
Shintaro Iwahashi
Ayumu Honda
Jumpei Kusuyama
Takayuki Kitajima
Akinori Yui
Hirotsugu Saito
Alexander H. Slocum
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117301 微粒子ピーニングによるレーザ焼結チタン合金の表面改質(OS04 材料・機械・構造物における強度と寿命1,オーガナイズド・セッション)
2011
Shintaro Iwahashi
Jun Komotori
Yujiro Yasutake
Masafumi Takei
Noriyuki Hisamori
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