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Y. Fu
Y. Fu
IBM
Composite material
Materials science
Ceramic
Electronic engineering
Thin film
3
Papers
6
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0
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Polyimide stress cushion for multichip glass-ceramic module packaging
1995
ECTC | Electronic Components and Technology Conference
D.-Y. Shih
P. Palmateer
Y. Fu
S. Kapur
Balaram Ghosal
Peter J. Brofman
Paul A. Lauro
M. Norcott
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Citations (4)
Designs of low stress I/O pin attach structures
1992
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Da-Yuan Shih
P. Palmateer
Y. Fu
J. Kim
S. Kapur
Anthony Francis Arnold
Peter J. Brofman
Balaram Ghosal
D. Waldman
P. Hayunga
R Pasco
S. Cvikevich
Joseph Alfred Corso
G. Advocate
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Citations (2)
FIBER-END CRACKING IN BRITTLE-MATRIX COMPOSITES: A MODEL STUDY
1990
J.A. Casey
Y. Fu
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