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Paul R. Besser

Advanced Micro Devices

75

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1057

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Airgaps in nano-interconnects: Mechanics and impact on electromigration

2016 Journal of Applied Physics
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Stress gradients observed in Cu thin films induced by capping layers

2010 Journal of Materials Research
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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

2009 Journal of Electronic Materials
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Dependence of electromigration failure modes on EM-induced and thermally-induced mechanical stress in interconnect lines

2008
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X‐ray determination of strains, stress, and relaxation in interconnect metallizations

2008
- Paul R. Besser
- John C. Bravman
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Extendibility of NiPt silicide to the 22-nm node CMOS technology

2008 IWJT | International Workshop on Junction Technology
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Stress gradients induced in Cu films by capping layers

2008 Applied Physics Letters
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Implementation of Robust Nickel Alloy Salicide Process for High-Performance 65nm SOI CMOS Manufacturing

2007 VLSI-TSA | International Symposium on VLSI Technology, Systems, and Applications
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Electromigration‐induced Plasticity and Texture in Cu Interconnects

2007
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Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

2007 IRPS | International Reliability Physics Symposium
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Citations (5)